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Department of Mechanical and Materials Engineering
College of Engineering and Computing
Florida International University, Miami, Florida
 Detailed InformationPrograms of StudyThe Master of Science in Mechanical Engineering Program provides students and practicing engineers with advanced studies in such areas of specialization as mechanical systems, mechanics, robotics and mechatronics, thermo/fluid systems, HVAC, material characterization, manufacturing and automation systems, biomechanics, laser and plasma materials processing, electronic packaging, optical measurement and diagnostics, and waste management, among others. Students in the thesis program complete a minimum of 24 semester credit hours of course work, plus 6 semester credit hours of research, as well as the Graduate Seminar. Nonthesis students complete a minimum of 33 semester credit hours of graduate course work, one semester of the Graduate Seminar, and a comprehensive exam.
The Master of Science in Materials Science and Engineering (M.S.M.S.E.) Program offers specializations in metallurgy, ceramics, electronic materials, and nanomaterials as well as polymers and biomaterials. Thesis students complete a minimum of 24 semester credit hours of course work, plus a minimum of 6 semester credit hours of the thesis, and the Graduate Seminar. Nonthesis students take a minimum of 30 semester credit hours of graduate course work and one semester of the Graduate Seminar. Thesis and nonthesis students are required to pass a comprehensive examination.
The Ph.D. in Mechanical Engineering Program prepares graduates for industrial or academic research in several areas of specialization, including thermodynamics, fluid dynamics, mechanics, materials, and design and manufacturing. The degree requires a total of 78 credit hours beyond the bachelor’s degree, which include a minimum of 54 hours of course work and at least 24 hours of dissertation.
The Ph.D. in Materials Science and Engineering Program prepares graduates for industrial or academic research in several areas of specialization, including electronic materials, nanotechnology, metals and alloys, ceramics, and polymer science and biomaterials. The degree requires a total of 78 credit hours beyond the bachelor’s degree, which includes a minimum of 54 hours of course work and at least 24 hours of dissertation.
The Department also offers a graduate certificate in mechanical engineering, with a more focused curriculum for the practicing engineer. The program consists of two concentration areas–design, mechanics, and robotics and thermofluids–reflecting the diverse nature of mechanical engineering. Students must take 18 credit hours (six 3-credit courses) and maintain a minimum 3.0 GPA to earn this certificate. Research FacilitiesThe College of Engineering and Computing has numerous research institutes, centers, and laboratories that support its academic and research programs. The institutes include the AccessGrid Virtual Institute (AGVI), the Advanced Materials Research Institute (AMERI), the Institute for Technology Innovation (ITI), and the Telecommunications and Information Technology Institute (IT2).
The research centers include the Applied Research Center (ARC), the Center for Advanced Distributed System Engineering (CADSE), the Center for Advanced Technology and Education (CATE), the Center for the Study of Matter at Extreme Conditions (CeSMEC), the Center for Energy and Technology of the Americas (CETA), the Center of Emerging Technologies for Advanced Information and High-Confidence Systems (CREST), the Engineering Information Center (EIC), the Engineering Manufacturing Center (EMC), the High Performance Database Research Center (HPDRC), the Lehman Center for Transportation Research (LCTR), the IBM Latin American Supercomputing Consortium (LA GRID), and the Motorola Nanofabrication Research Facility.
Research laboratories include the Autonomic Computing Research Laboratory (ACRL), the Construction and Structures Research and Testing Laboratory, the Distributed Multimedia Information System Laboratory (DMIS), the Digital Signal Processing Laboratory (DSP), the Enterprise Information Systems Research Laboratory, the Enterprise Systems Engineering Laboratory (ESE), the Graphic Simulation Laboratory (GSL), the Human Factors and Ergonomics Laboratory, the Information Systems Research Laboratory, the Laboratory for Wind Engineering Research (LWER), the Multidisciplinary Analysis, Inverse Design, Robust Optimal Control Laboratory (MAIDROC), the Optical Imaging and Tomography Laboratory, the Plasma Forming Laboratory (PFL), and the Photonics Research Laboratory.
Affiliated Centers and Programs include the AMPATH International Exchange Point in Miami, CHEPREO: Center for High Energy Physics Research and Education Outreach, CIARA: Center for Internet Augmented Research and Assessment, CyberBridges, GEC: The Eugenio Pino and Family Global Entrepreneurship Center, IHRC: the International Hurricane Research Center, MOTOROLA Women in Engineering (MWIE), NASA ALLSTAR Project, and Ware Foundation Neuro-Engineering and Brain Research Laboratory at Miami Children’s Hospital. Financial AidThe College of Engineering and Computing offers a variety of merit-based fellowships, assistantships, and scholarships to qualified domestic and international students. These awards are highly competitive, and the amounts vary depending on the type of the award. Additional financial aid information is available from the Financial Aid Office at http://www.fiu.edu/orgs/finaid. Cost of StudyFor the 2009–10 academic year, tuition is $340.68 per credit for Florida residents and $844.76 per credit for out-of-state and international students. Students pay an additional $170 per semester for student activity fees, a health fee, a photo ID, and parking. Books and supplies are estimated at $1200 per semester, and health insurance costs $1800 for two semesters. Living and Housing CostsGraduate student housing is available at University Park (305-348-4190) and the Biscayne Bay Campus (305-919-5587). On-campus housing ranges between $4930 and $6600 per semester, depending on the type of accommodation and meal plan selected. Additional information about on- and off-campus housing can be found through the Office of Housing and Residential Life Web site at http://www.fiu.edu/~housing. Student GroupThe College of Engineering and Computing has 892 graduate students, of whom 515 are full-time, 225 are women, and 431 are international students. LocationGreater Miami is noted for its cultural diversity. Greater Miami has extensive cultural amenities, such as the New World Symphony, the Florida Grand Opera, and the Miami City Ballet, in addition to a tropical climate. The area has franchises in all major sports, and the University has inaugurated intercollegiate football to round out its extensive sports offerings. Miami is a major transportation hub with easy air and sea connections throughout the Americas and Europe. The University and The CollegeFlorida International University (FIU) is Miami’s first public four-year university. With more than 39,000 students, almost 1,100 full-time faculty members, and 124,000 alumni, FIU is the largest university in South Florida and one of the most dynamic institutions in the United States. The University’s growth in enrollment and stature in the academic community are remarkable. In four decades, FIU has become nationally renowned as a doctoral-granting institution, with more than 200 degree programs. For the past five years, FIU was ranked among the top 100 public universities in U.S. News & World Report’s “America’s Best Colleges,” and it is also is ranked as a Research University in the High Research Activity category of the Carnegie Foundation’s prestigious classification system. FIU recently graduated its first law class, and opened a medical school, attesting to the University’s growth and recognition.
The College of Engineering and Computing is South Florida’s leading engineering education resource. The College offers a full range of bachelor’s, master’s, and doctoral degree programs in engineering, construction, management, and computer sciences. Research is an integral part of the College’s mission and its success, with over $90 million in external research funding over the last five years from a variety of governmental and corporate sources. ApplyingApplicants must submit the completed application, the application fee, official transcripts, and GRE scores. In addition, Ph.D. applicants must submit three letters of recommendation and a resume or curriculum vitae. International students must send in their TOEFL scores and have their transcripts evaluated. Completed applications and supporting documents should be sent at least 120 days prior to the beginning of the academic session intended for enrollment. The Faculty and Their Research
- Arvind Agarwal, Associate Professor; Ph.D., Tennessee. Plasma Forming Laboratory (PFL) to make use of plasma-based techniques to synthesize near net shape structures by rapid prototyping; bulk nanostructured components; advanced ceramic and metallic nanocomposites; multilayered functional coatings; synthesis of nanostructured composite powders; carbon nanotube composites; surface engineering for corrosion, erosion, and wear-resistant coatings; ultrahigh temperature ceramic coatings and composites; biocompatible coatings.
- Yiding Cao, Professor; Ph.D., Dayton. Heat pipes, electronic cooling, gas turbines, fuel cell systems.
- Jiuhua Chen, Associate Professor and Graduate Program Director; Ph.D., Tennessee, Knoxville. Earth and planetary science, high-pressure physics, materials science.
- Won-Bong Choi, Associate Professor; Ph.D., North Carolina State. Nanotube-based single-chip computer, nano e-beam source, nano-biosensor, nanotube-based nonvolatile memory device, nanotemplate films for nano application, nanofilter for lab-on-a-chip.
- George S. Dulikravich, Professor; Ph.D., Cornell. Computational and analytical fluid mechanics; subsonic, transonic, and hypersonic aerodynamics; theoretical and computational electromagneto-hydrodynamics; conjugate heat transfer, including solidification; computational cryobiology; acceleration of iterative algorithms; computational grid generation; multidisciplinary aero-thermo-structural inverse problems; design and constrained optimization in turbomachinery; multiobjective optimization of chemical compositions of alloys using distributed parallel computing environments.
- Ali Ebadian, Professor; Ph.D., LSU. Founding Director, Center for Energy and Technology (CETA) and Hemispheric Center for Environmental Technology (HCET). Environmental management: nuclear, pollution prevention, hazardous materials, and brownfields; energy security: renewable, alternative fuels, and hydrogen economy.
- Dennis Fan, Instructor; Ph.D., SUNY at Stony Brook. Investigations of novel ultrafast laser-based techniques for measuring, materials processing, microfabricating, nonlinear imaging, biomedical and microscale engineering systems.
- Gordon Hopkins, Professor Emeritus; Ph.D., Alabama. Engineering mechanics.
- W. Kinzy Jones, Professor and Director of AMERI; Ph.D., MIT. Electronic packaging and microelectronics, electronic and nanomaterials and MEMS fabrication.
- Xiangxing Kong, Research Assistant Professor; Ph.D., Beijing. Organic and polymer materials preparation, electrochemistry and organic electronics.
- Cesar Levy, Professor and Chair; Ph.D., Stanford. Vibration attenuation using SMA/VEM, SMA/PZT, and SMA/carbon nanotubes as sensors/actuators; fatigue life of cracked, thick-walled, pressurized, autofrettaged tubes; engineering education.
- Norman D. H. Munroe, Associate Professor and Associate Dean; Eng.Sc.D., Columbia. Chemical metallurgy.
- Surendra K. Saxena, Professor; Ph.D., Uppsala (Sweden). From solar gas to terrestrial planets, computation of phase equilibrium, fluids in Earth’s interior, thermodynamic databases, high pressure and high temperature experiments: iron phase diagrams and Earth’s core and stability of perovskite in the deep Earth.
- Yong X. Tao, Professor and Associate Dean; Ph.D., Michigan. Microscale heat transfer enhancement, heat transfer and fluid flow in porous media, frost growth on cold surfaces, wind turbine aerodynamics under icing conditions, convective melting under gravity or microgravity conditions, thin-film phase change heat transfer, computational fluid dynamics applications.
- Ibrahim Nur Tansel, Professor; Ph.D., Wisconsin–Madison. Acoustic emission-based tool breakage detector for micro-end-milling operation; micro-end-milling: wear and breakage, extending tool life with a smart workpiece holder, and wear estimation and tool breakage detection using acoustic emission signals; comparative analysis of fluorescent lamp recycling and disposal options; monitoring micro-drilling operations using neural networks; mapping of subsurface contaminant profiles by neural networks; assessing underground contamination concentration profiles by using neural networks; tool wear estimation in micromachining: tool usage cutting-force relationship and neural network–based periodic inspector for nonmetals; modeling micro-end-milling operations: analytical cutting-force model, tool run-out and influence of tool wear
- Sabri Tosunoglu, Associate Professor, Undergraduate Program Director, and Director, Robotics and Automation Laboratory; Ph.D., Florida. Robotics and automation systems, teleoperation and telesensation technologies, humanoid robots, mechatronics, modular design, fault-tolerant system design, fault-tolerant controllers, intelligent machine control.
- Igor Tsukanov, Assistant Professor; Ph.D., Northwestern. Computational solid mechanics and dynamics, finite-element computational modeling.
- Chunlei (Peggy) Wang, Assistant Professor; Ph.D. Jilin (China). Materials science, specifically in CVD diamond growth, carboneous materials, Si processing, GaN-based LED, advanced packaging, MEMS, carbon-MEMS/NEMS, 3-D microbatteries, nanoscale materials, biosensors, conductive polymers and drug delivery.
- Kuang-Hsi Wu, Professor; Ph.D., Illinois at Urbana-Champaign. Nanocomposites, shape memory alloys and smart materials, finite element analysis, advanced and novel materials.
Correspondence and InformationFlorida International University College of Engineering and Computing 10555 West Flagler Street, EC2430 Miami, Florida 33174-1630 Telephone:
305-348-1890 Fax:
305-348-6142
Email:
grad_eng@fiu.edu
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