Avg. Amount Awarded
February 15 2023
Application Deadline
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What you'll need:
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Corrugated Packaging Scholarships


Must demonstrate an interest in the corrugated packaging industry (part time employment or internships in the corrugated industry are looked upon in a very favorable manner). Up to five scholarships are offered each year, funded by endowments from both TAPPI and industry supporters, including: 1. Mitsubishi Heavy Industries , 2. The Bobst Group, 3. John O. Telesca Engineering Scholarship, 4. Corrugated Suppliers Advisory Committee, 5. Corrugated Packing Division

Amount Details

Low Amount Awarded

Eligibility Requirements

  • CheckmarkMust be an undergraduate student or a graduate student
  • CheckmarkMust attend a university or a vocational-tech school
  • CheckmarkBoth full-time and part-time students
  • CheckmarkRestricted to students studying Paper and Pulp Engineering

How to Apply

What you'll need:

  • Checkmark Application Form
For more info, please visit our site
Contact Lisa Lockwood
Scholarships Contact
Tel: 770-209-7276 Address 15 Technology Parkway South
Suite 115
Peachtree Corners, GA 30092