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May 15 2021
Application Deadline
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What you'll need:
  • Checkmark Essay
Electronics Division Lewis C. Hoffman Scholarships


The Lewis C. Hoffman Scholarship is a $2,000 undergraduate tuition award that is given to encourage academic interest and excellence in the area of ceramics/materials science and engineering. The 2018 essay topic is "Tailoring Material Properties through Defect Engineering for Electronic Ceramics." Deadline for applications is 15 May 2018.

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Eligibility Requirements

  • CheckmarkMust attend a university or a four-year college
  • CheckmarkMust not be attending high school currently
  • CheckmarkMust study full-time
  • CheckmarkRestricted to students studying Materials Science, Engineering, and Metallurgy

How to Apply

What you'll need:

  • Checkmark Essay