$2,000
Avg. Amount Awarded
147
Days
May 15 2019
Application Deadline
1
Awarded last year
No
Renewable
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What you'll need:
  • Checkmark Essay

Description

The Lewis C. Hoffman Scholarship is a $2,000 undergraduate tuition award that is given to encourage academic interest and excellence in the area of ceramics/materials science and engineering. The 2018 essay topic is "Tailoring Material Properties through Defect Engineering for Electronic Ceramics." Deadline for applications is 15 May 2018.

Amount Details

$2,000
Low Amount Awarded
$2,000
Total Amount Awarded

Eligibility Requirements

  • CheckmarkMust attend a university or a four-year college
  • CheckmarkMust not be attending high school currently
  • CheckmarkMust study full-time
  • CheckmarkRestricted to students studying Materials Science, Engineering, and Metallurgy

How to Apply

What you'll need:

  • Checkmark Essay