The International Flexible Packaging and Extrusions - The Daniel Siegel Memorial Scholarship will be awarded to encourage talented science and engineering students to pursue careers in the packaging industry, to develop awareness of the industry, and strengthen the TAPPI International Flexible Packaging and Extrusions (IFPED) Division. The Daniel Siegel Memorial Scholarship is presented only in even-numbered years. The scholarship will be awarded to a TAPPI Student Chapter member enrolled in a packaging or related major. Industries pertaining to these technologies include packaging, industrial films and laminations, blown and cast films extrusion, extrusion coatings and laminations, sheet extrusion, and printing associated with these areas. Applicants must demonstrate an interest in the technological areas covered by the International Flexible Packaging and Extrusions Division. Please visit the scholarship's website or contact the Technical Association of the Pulp and Paper Industry for more information.