Varies
Avg. Amount Awarded
79
Days
February 25 2023
Application Deadline
No
Renewable
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What you'll need:
  • Checkmark Application Form
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International Flexible Packaging and Extrusions - The Daniel Siegel Memorial Scholarship

Description

The International Flexible Packaging and Extrusions - The Daniel Siegel Memorial Scholarship will be awarded to a TAPPI Student Chapter member enrolled in a packaging or related major. Industries pertaining to these technologies include packaging, industrial films and laminations, blown and cast films extrusion, extrusion coatings and laminations, sheet extrusion, and printing associated with these areas. Applicants must demonstrate an interest in the technological areas covered by the International Flexible Packaging and Extrusions Division.

Amount Details

$4,000
Low Amount Awarded

Eligibility Requirements

  • CheckmarkMust be an undergraduate student
  • CheckmarkMust attend a university, a four-year college or two-year college
  • CheckmarkMust not be attending high school currently
  • CheckmarkMust study full-time
  • CheckmarkRestricted to students studying Paper and Pulp Engineering

How to Apply

What you'll need:

  • Checkmark Application Form
For more info, please visit our site
Contact Lisa Lockwood
Scholarships Contact
scholarships@tappi.org
Tel: 770-209-7246 Address 15 Technology Parkway South
Suite 115
Peachtree Corners, GA 30092