Scholarship Undergraduate

International Flexible Packaging and Extrusions - The Daniel Siegel Memorial Scholarship

Technical Association of the Pulp & Paper Industry

Varies
Avg. Amount Awarded
140
Days
February 15 2022
Application Deadline
No
Renewable
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What you'll need:
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International Flexible Packaging and Extrusions - The Daniel Siegel Memorial Scholarship
Apply Now
Save
Apply Now
Save

Description

The Flexible Packaging Division - The Daniel Siegel Memorial Scholarship encourages talented science and engineering students to pursue careers in the packaging industry and to develop awareness of the industry, and of the TAPPI International Flexible Packaging and Extrusion Division (IFPED). This $4,000 scholarship is presented in even-numbered years, and will be awarded to a TAPPI Student Chapter member enrolled in a packaging or related major. The scholarship is funded by an endowment from MICA Corporation and the Siegel family.

Amount Details

$4,000
Low Amount Awarded

Eligibility Requirements

  • CheckmarkMust be an undergraduate student
  • CheckmarkMust attend a four-year college or two-year college
  • CheckmarkMust study full-time

How to Apply

What you'll need:

  • Checkmark Application Form
Contact Lisa Lockwood
Director of Standards and Awards
scholarships@tappi.org
Tel: 770-209-7276 Address 15 Technology Parkway South
Suite 115
Peachtree Corners, GA 30092