Scholarship Undergraduate Graduate

International Flexible Packaging and Extrusions - The Daniel Siegel Memorial Scholarship

Technical Association of the Pulp and Paper Industry

Varies
Avg. Amount Awarded
213
Days
February 15 2026
Application Deadline
N/A
Renewable
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What you'll need:
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International Flexible Packaging and Extrusions - The Daniel Siegel Memorial Scholarship
Apply Now
Save
Apply Now
Save

Description

Each year, TAPPI is proud to offer multiple scholarship opportunities to graduate and undergraduate students in the pulp, paper, packaging and related industries. The Daniel Siegel Memorial Scholarship is funded by an endowment from MICA Corporation and the Siegel family. Applicants must demonstrate an interest in the technological areas covered by the International Flexible Packaging and Extrusion Division. Please visit the scholarship's website for more information.

Amount Details

$7,000
Low Amount Awarded

Eligibility Requirements

  • CheckmarkMust be an undergraduate student or a graduate student
  • CheckmarkMust attend a university or a four-year college
  • CheckmarkMust not be attending high school currently
  • CheckmarkRestricted to students studying Paper and Pulp Engineering

How to Apply

What you'll need:

  • Checkmark Application Form
For more info, please visit our site
Contact Jonathan Adan

jadan@tappi.org
Tel: 770-446-1400
Fax: 770-446-6947 Address 15 Technology Parkway South, Suite 115
Peachtree Corners, GA 30092