International Flexible Packaging and Extrusions - The Daniel Siegel Memorial Scholarship
Amount Details
$7,000
Low Amount Awarded
Eligibility Requirements
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Must be an undergraduate student or a graduate student
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Must attend a university or a four-year college
Must not be attending high school currently
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Restricted to students studying Paper and Pulp Engineering
How to Apply
Contact
Jonathan Adan
jadan@tappi.org
Tel: 770-446-1400
Fax: 770-446-6947 Address 15 Technology Parkway South, Suite 115
Peachtree Corners, GA 30092
jadan@tappi.org
Tel: 770-446-1400
Fax: 770-446-6947 Address 15 Technology Parkway South, Suite 115
Peachtree Corners, GA 30092